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Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll

100kg
MOQ
negotiable
harga
Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll
fitur Galeri Deskripsi Produk Quote request suatu
fitur
Spesifikasi
Kemurnian: 99,95%
Anti oksidasi: 180 derajat 60 menit, 180 hari 23 derajat
Ketebalan: 1/2 ons, 3/4 ons, 1 ons, 2 ons,
Warna: merah atau hitam
Pemanjangan: 1,5%
Daya tarik: 160 MPa
Kekuatan kulit: 1 N/mm
Profil foil: RA≤0,15μm,Rz≤1,7μm
panjang per gulungan: 500 - 5000 Meter
Antar Diameter: 76 Mm,152 Mm, 3 Inci,6 Inci
Menyoroti:

electrodeposited copper foil

,

copper thin sheet

Informasi dasar
Place of Origin: China
Nama merek: JIMA
Sertifikasi: SGS, ISO,Reach, RoHS
Model Number: EDCU-HC
Syarat-syarat pembayaran & pengiriman
Packaging Details: wooden carton
Delivery Time: 5-15 days
Payment Terms: T/T, L/C
Supply Ability: 1000 Ton per month
Deskripsi Produk

350kgs big roll  HTE ED electrolytic copper foil for printed circuit board PCB​ antenna PCB

 

Detail Specification:

Single side treatment in red.
Nominal Thickness: 0.012-0.070 mm
Width range: 5-1380mm,standard width:1290mm
Length range : 500-5000 M
Internal diameter: 3 inch/6 inch.
stype:matte

 

Classify:

 

(STD-E)- standard electrodeposited copper foil.

(HD-E)-high ductility electrodeposited copper foil.

(HTE-E)-high temperature elongation electrodeposited copper foil.

Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll 0

Copper foil Applicatio

  PCB industry .
application PCB manufacture
  antenna PCB,Epoxy board
  Epoxy board

FAQ:

Q1: Can you customize the special size as per our requirement?

A:we can cut into as your request size.

Q16. How to save after the box opened?

A: Keep the dry environment,and is better use it in 30days.

Q4: Can you supply the sample?

A: We can supply A4 samples

 

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.

We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp

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