Place of Origin: | china |
Nama merek: | JIMA |
Sertifikasi: | SGS, ISO,Reach, RoHS |
Model Number: | EDCU-HC |
Minimum Order Quantity: | 100kg |
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Harga: | negotiable |
Packaging Details: | wooden carton |
Delivery Time: | 5-15 days |
Payment Terms: | T/T, L/C |
Supply Ability: | 1000 Ton per month |
Kemurnian: | 99,95% | lubang jarum: | Tidak ada |
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Anti oksidasi: | 180 derajat 60 menit, 180 hari 23 derajat | Ketebalan: | 1/2 ons, 3/4 ons, 1 ons, 2 ons, |
Warna: | merah atau hitam | Pemanjangan: | 1,5% |
Daya tarik: | 160 MPa | Kekuatan kulit: | 1 N/mm |
Profil foil: | RA≤0,15μm,Rz≤1,7μm | Aplikasi:: | FCCL, FPC |
panjang per gulungan: | 500 - 5000 Meter | Antar Diameter: | 76 Mm,152 Mm, 3 Inci,6 Inci |
Menyoroti: | copper foil paper,hvlp copper foil |
1oz ED electrolytic High ductility copper foil
Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition.
Thickness: 1OZ
Width: 1380 mm
Length: 500-5000 M
ID: 76 mm,152 mm
Purity:99.8%
Manufacturing Process:
In an electrodeposited copper manufacturing process, the copper foil is deposited on a titanium rotating drum from a copper solution where it is connected to a DC voltage source. The cathode is attached to the drum and the anode is submerged in the copper electrolyte solution. When an electric field is applied, copper is deposited on the drum as it rotates at a very slow pace. The copper surface on the drum side is smooth while the opposite side is rough. The slower the drum speed, the thicker the copper gets and vice versa. The copper is attracted and accumulated on the cathode surface of the titanium drum. The
matte and drum side of the copper foil go through different treatment cycles so that the copper could be suitable for PCB fabrication. The treatments enhance adhesion between the copper and dielectric interlayer during copper clad lamination process. Another advantage of the treatments is to act as anti-tarnish agents by slowing down oxidation of copper.
Application:
.Epoxy board
Difference between CA copper foil and ED copper foil
Property | Electrodeposited | Rolled | |||||
8um | 18um | 35um | 70um | 18um | 35um | 70um | |
Tensile strength,kpsi | 15 | 33 | 40 | 40 | 20 | 22 | 28 |
Elongation,% | 2 | 2 | 3 | 3 | 8 | 13 | 27 |
Vol resistivity Mohm.cm |
1.66 | 1.62 | 1.62 | 1.78 | 1.74 | 1.74 |
FAQ:
Q1. Can we come to China visit factory ?
Yes ,you can .
Q2. Can you cut into small size?
Yes, we can.
Q3. Is the copper foil Floating in box?
Yes, it is .
Typical properties of high ductility copper foil
Classification
|
Unit | Requirement | Test Method | |||||||||||
Foil Designation | / | T | H | M | 1 | 2 | 3 | IPC-4562A | ||||||
Nominal thickness | / | 12um | 1/2 OZ | 3/4 OZ |
1 OZ |
2 OZ |
3 OZ |
IPC-4562A | ||||||
Area Weight | g/㎡ | 107±4 | 153±5 | 228±8 | 285±10 | 580±15 | 860±20 |
IPC-TM-650 2.2.12.2 |
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Purity | % | ≥99.8 |
IPC-TM-650 2.3.15 |
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Foil Profile | Shiny side (Ra) | սm | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
IPC-TM-650 2.3.17 |
|||||
Matte side(Rz) | um | ≤6 | ≤8 | ≤10 | ≤10 | ≤15 | ≤20 | |||||||
Tensile Strength |
R.T.(23℃)
|
Mpa | ≥150 | ≥150 | ≥235 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
|||||
Elongation |
R.T.(23℃)
|
% | ≥5 | ≥5 | ≥10 | ≥10 | ≥15 | ≥15 |
IPC-TM-650 2.3.18 |
|||||
Subject | Ω.g/㎡ | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | ≤0.162 |
IPC-TM-650 2.5.14 |
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Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | ≥2.1 |
IPC-TM-650 2.4.8 |
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Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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Anti-oxidization | R.T.(23℃) | day | 180 | / | ||||||||||
H.T.(200℃) | Minutes | 60 | / |
3. Standard Width,1380(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
Kontak Person: JIMA Annie
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