ED Copper Foils 12um 18um 25um 35um untuk Bahan FPC & EMI
>.perawatan foil profil rendah di belakang / merah.
>.Tebal: 12 ~ 35µm
>.Lebar: 200-1340mm
>.Pertunjukan: Permukaan produk berwarna hitam atau merah, memiliki kekasaran permukaan yang lebih rendah.
>.Aplikasi: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, film tipis kristal berlapis LED.Tabel1- Kinerja:
Sifat khas dari Foil Tembaga Profil Rendah
| Klasifikasi | Satuan | Kebutuhan | Metode Tes | ||||||
| Ketebalan nominal | / | 12um | 1/2 OZ (18um) | 3/4 OZ (25um) | 1 OZ (35um) | 50UM | 70UM | 105UM | IPC-4562A |
| Berat Area | g / ㎡ | 107 ± 4 | 153 ± 5 | 228 ± 8 | 285 ± 10 | 435 ± 15 | 585 ± 20 | 870 ± 30 | IPC-TM-650 2.2.12.2 |
| Kemurnian | ％ | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Kekasaran | Sisi mengkilap (Ra) | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
| Sisi Matte (Rz) | um | ≤4.5 | ≤5.0 | ≤6.0 | ≤7.0 | ≤8.0 | ≤12 | ≤14 | |
| Daya tarik | RT (23 ℃) | ≥207 | ≥207 | ≥207 | ≥276 | ≥276 | ≥276 | ≥276 | IPC-TM-650.2.4.18 |
| HT (180 ℃) | Mpa | ≥138 | |||||||
| Pemanjangan | RT (23 ℃) | ≥4 | ≥4 | ≥5 | ≥8 | ≥10 | ≥12 | ≥12 | IPC-TM-650.2.3.18 |
| HT (180 ℃) | ％ | ≥4 | ≥4 | ≥5 | ≥6 | ≥8 | ≥8 | ≥8 | |
| Kekuatan Kupas (FR-4) | N / mm | 0.8 | ≥1.0 | ≥1.1 | ≥1.2 | ≥1.4 | ≥2.0 | ≥2.0 | IPC-TM-650 2.4.8 |
| Ibs / in | 4 | ≥4.6 | ≥5.7 | ≥6.3 | ≥7 | ≥8 | ≥11.4 | ≥11.4 | |
| Lubang kecil & porositas | Jumlah | Tidak | IPC-TM-650 2.1.2 | ||||||
| Anti-oksidasi | RT (23 ℃) | 180 | |||||||
| HT (200 ℃) | 60 menit | 30 | |||||||
Gambar Foil Tembaga Profil Rendah
