Name: 70um width Electrolytic HTE Copper Foil / Copper Sheet Roll
Brand: JIMA Copper
SKU: EDCU-HC
Price: 16.00 USD
Availability: InStock

Rumah Produk HTE Copper Foil

70um width Electrolytic HTE Copper Foil / Copper Sheet Roll

Detail produk:

Place of Origin:	China
Nama merek:	JIMA
Sertifikasi:	SGS, ISO,Reach, RoHS
Model Number:	EDCU-HC

Syarat-syarat pembayaran & pengiriman:

Minimum Order Quantity:	150kg
Harga:	negotiable
Packaging Details:	wooden carton
Delivery Time:	5-25days
Payment Terms:	T/T, L/C
Supply Ability:	1000 Ton per month

Kontak

Detil Deskripsi produk

Purity:	99.95%	Thickness:	70um,35um
Color:	red or black	Standard:	IPC-4562
Inter Diameter:	76 Mm，152 Mm， 3 Inch，6 Inch	products name:	Electrolytic HTE Copper Foil with width 70um For PCB laminate
high temperature elongation copper foil:	120 min (180 °C in Atmosphere)
Menyoroti:	roll of copper foil , electrodeposited copper foil

Electrolytic HTE Copper Foil with width 70um For PCB laminate

Detail Specification:

Single side treatment in red. and single Side Shiny

Thickness: 70um,35um

Width range: 5-1380mm,standard width:1290mm

high temperature elongation copper foil :120 min (180 °C in Atmosphere)

Internal diameter: 3 inch/6 inch.

Standard :IPC-4562

Classify:

(STD-E)- standard electrodeposited copper foil.

(HD-E)-high ductility electrodeposited copper foil.

(HTE-E)-high temperature elongation electrodeposited copper foil.

70um width Electrolytic HTE Copper Foil / Copper Sheet Roll 0

Copper foil Application

	1>PCB industry .
Application	2>PCB manufacture
	3>antenna PCB,Epoxy board
	4>PCB laminate 5>Multi-layer printed circuit boards.

Features and advantages

1.The thermally stable microstructures with their stable mechanical properties

2. improve dimensional stability

3.Reduce bulging, warping and nail head formation.

These resist thermal outliers which typically occur during laminates.

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness		um	9	12	18	25	35	70	IPC 4562 4.6.3.1
Area weight		g/m²	80±1	107±3	153±	215±5	285±5	585±8	IPC 4562 4.6.3.2
Roughness	(RA)	μm	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	IPC 4562 4.6.9
Roughness	(RZ)	μm	<6.0	<6.5	<8.0	<9.0	≤10.0	<15	IPC 4562 4.6.9
Copper≧		%	99.8						IPC 4562 4.6.3.1
Tensile Strength	state normal	Mpa	>300	>300	>300	>300	>300	>280	IPC 4562 4.6.4
Tensile Strength	state temper (180℃)	Mpa	>15.0	>18.0	>18.0	>18.0	>18.0	>18.0	IPC 4562 4.6.4
ElongationI	state normal	%	>3.0	>3.0	>5.0	>6.0	>10.0	>10.0	IPC 4562 3.5.3
ElongationI	state temper (180℃)	%	>2.0	>2.5	>2.5	>3.0	>5.0	>5.0	IPC 4562 3.5.3
Peel strength		N/mm	>1.0	>1.05	>1.35	>1.70	>1.8	>2.0	IPC 4562 4.6.7
High temperature oxidation resistance(200℃, 40min)		No color change							Standard
Solderability		Good							Standard
Solderability		Good							IPC 4562 4.6.12